选择性螯合滴定法测定酸铜镀液中的CuSO_4  

Selective Chelatometric Determination of CuSO_4 in Copper Plating Solution

作　　者：卢燕 

机构地区：[1]广东华丽电镀工业公司

出　　处：《电镀与涂饰》1995年第1期13-15,共3页Electroplating & Finishing

摘　　要：本文提出一种测定ＣｕＳＯ４含量的螯合滴定方法。该方法是在酸铜镀液中，加入过量的ＥＤＴＡ络合全部的金属离子，再用硫脲、抗坏血酸和１，１０－二氮杂菲选择性地分解Ｃｕ－ＥＤＴＡ。该方法有效地消除了镀液中Ｆｅ３＋、Ｚｎ２＋、Ａｌ３＋等杂质金属离子对测定结果的干扰，方法简便，结果准确，已被成功用于镀铜生产中ＣｕＳＯ４的测定。A simple chelatometric method for determination of Cu2+ is presented. The process is based on initial complexation of Cu2+ Fe3+ Zn2+ Al3+ and other metal ions in solution with excessive amount of EDTA and subsequent decomposition of Cu-EDTA with thiourea, ascorbic acid, O-phenanthroline. The method has been successively used for determination of Cu2+ in copper sulfate plating bath.

关 键 词：镀铜 螯合滴定 硫酸铜 镀液 电镀 

分 类 号：TQ153.14[化学工程—电化学工业]