选择性螯合滴定法测定镍含量  

Selective Chelatometric Determination of Nickel

作　　者：王献科[1] 李玉萍[1] 

机构地区：[1]兰州市东岗镇钢厂

出　　处：《电镀与涂饰》1995年第3期25-28,共4页Electroplating & Finishing

摘　　要：选择性螯合滴定法测定镍是采用过量ＥＤＴＡ螯合镍离子及其它金属离子，然后用ＳＣＮ－、Ｃ５Ｈ５Ｎ选择分解Ｎｉ—ＥＤＴＡ，释放出ＥＤＴＡ，用Ｐｂ（ＮＯ３）２标准溶液滴定，从而计算镍的含量。以ＸＯ—ＭＴＢ－ＣＰＢ为混合指示剂，终点变化敏锐。本法操作简便，结果准确，可用于测定电镀液和镍基合金镀层中的镍。A simple and rapid selective chelatometric determination method is based on initial complexation of Ni2+ and other metal ions with excessive amount of EDTA and subsequent decomposition of Ni-EDTA with thiocyanate(SCN-) and pyridine (C5H5N).The liberated EDTA is titrated with Pb(NO3)2 standard,solution. A sensitive and clear end point is obtained by using XO-MTB-CPB as mixture indicator. The method may be used for determination of Nib+ in Ni-alloy plating bath and Ni-alloy deposit.

关 键 词：镀镍 螯合滴定 电镀 镀液 

分 类 号：TQ153.12[化学工程—电化学工业]