工艺因素对玻璃与可伐合金浸润性的影响  

Effect of Process Factors on Wettability of Kovar by Glass

作　　者：朱奇农[1] 马莒生[1] 唐祥云[1] 

机构地区：[1]清华大学材料科学与工程系

出　　处：《电子元件与材料》1995年第2期54-56,共3页Electronic Components And Materials

摘　　要：测定了在不同工艺条件下ＤＭ－３０５及ＢＨ－Ｇ／Ｋ两种玻璃与可伐合金之间的浸润角大小。对浸润角受气氛和金属表面氧化膜成分的影响进行了研究。为合理选择该种玻璃与可伐合金的封接工艺提供了理论依据。Contact angles between Kovar and two types of glass DM-305 and BH-G/K under different processing condition were measured. It is indicated that contact angle is affected by the composition of oxide on metal surface and atmosphere. This result provides theoretical basis for appropriate selection of process fartors of sealing Kovar and glass.

关 键 词：封接 可伐合金 玻璃 集成电路 浸润性 

分 类 号：TN405[电子电信—微电子学与固体电子学]