Cu－TiC纳米晶复合薄膜的研究  

Investigation of Cu-TiC Nanocrystalline Composite Films

作　　者：李戈扬[1] 王岱峰[1] 王公耀 李鹏兴[1] 

机构地区：[1]上海交通大学金属基复合材料国家重点实验室

出　　处：《功能材料》1995年第5期453-455,共3页Journal of Functional Materials

摘　　要：本文采用多靶磁控溅射技术，通过分别控制Ｃｕ和ＴｉＣ靶的溅射功率制取了不同ＴｉＣ含量的复合薄膜，采用ＸＲＤ、ＸＰＳ和ＴＥＭ技术分析了薄膜的组织结构，并测定了薄膜的硬度和电阻率。研究结果表明：随ＴｉＣ含量的增加，Ｃｕ－ＴｉＣ复合薄膜的晶粒逐步细化，直至形成纳米晶，与此相应，薄膜的硬度提高，导电性降低。Nanocrystalline Cu-TiC compositefilms with various TiC contents were prepared byusing multi-targets magnetron sputtering technique,in which the sputtering power of Cu and TiC targetswere separately controlled; Microhardness andresistivity of the films were measu red while themicrostructure was evaluated bv means of XRD,XPSand TEM.It was found that as TiC contentincreasing,the film grain was refined to nano scale,meanwhile,film hardness and resistivity increased。

关 键 词：磁控溅射 铜 复合薄膜 碳化钛 纳米晶粒 

分 类 号：TN304.055[电子电信—物理电子学] TN305.92