“电位活化”现象与金属电沉积初始过程研究简报  

Study of potential activation phenomenon and initial process of the metal electrodeposition

作　　者：冯绍彬[1] 董会超[1] 张胜利[1] 商士波[1] 包祥[1] 刘清[1] 

机构地区：[1]郑州轻工业学院材料与化学工程学院,河南郑州450002

出　　处：《郑州轻工业学院学报（自然科学版）》2005年第2期26-29,共4页Journal of Zhengzhou University of Light Industry:Natural Science

基　　金：国家自然科学基金资助项目(20376077)

摘　　要：针对无氰电镀在镀层结合强度方面还存在的一些问题,用"电位活化"概念给出了理论解释,并从宏观到微观多方位地揭示了电位活化现象的电化学本质:恒电流法电位-时间曲线显示出了金属电沉积初始过程的电位活化平阶和特点;Ar+离子纵向深度溅射与X射线光电子能谱分析(XPS)相结合证实了电镀层结合强度差的原因是电沉积初始过程中镀层/基体界面氧化层的存在.保证电镀层与金属基体良好结合的前提,即实现电位活化的条件是电镀液中金属离子的还原电位必须负于基体金属表面氧化层的活化电位.同时给出了结合强度可与氰化物电镀相近的铁基体上焦磷酸盐直接镀铜工艺.研究表明,镍电极上的电位活化问题也取得了与上述研究一致的结论.Bond intensity of non-cyanide plating layer has some questions. The conception of potential activation gives theoretical explanation of this question. Electrochemical essence of potential activation phenomenon was revealed from macrocosmic to microcosmic universally. The fiat step and character of potential activation in the initial process of metal electrodeposition were shown in the potential-time curves under the constant current.The combination of Ar ~ sputtering perpendicularly and X ray photoelectron spectroscopy proved that the cause of bad bond intensity of plating layer was the existence of oxygen layer in the interface of plating layer and substrate in the initial process of metal electrodeposition. The precondition of good bond intensity between plating layer and substrate, i.e. the condition of realizing potential activation was that the reduction potential of metal ion in the electrolyte is less than activation potential of oxygen layer in the surface of substrate. In the investigation, the pyrophosphate direction copper plating technology was given, and bond intensity of plating layer was close to one of cyanide copper plating. The investigation also showed that the results of potential activation on the nickel electrode were accorded with former study.

关 键 词：电位活化 无氰电镀 结合强度 

分 类 号：O646.1[理学—物理化学]