竹大片刨花板主要工艺参数的研究  

RESEARCH ON MAIN PROCESSING PARAMETERS OF BAMBOO-BASED WAFERBOARD

作　　者：张宏健[1] 叶喜[1] 李君 

机构地区：[1]西南林学院森工系

出　　处：《西南林学院学报》1995年第4期56-60,共5页Journal of Southwest Forestry College

基　　金：云南省应用基础研究基金

摘　　要：为提供竹大片刨花板工业化生产可靠的理论和技术基础，研究以预备试验确定的竹大片刨花随机层状胶合结构和制板工艺技术路线及其相关工艺参数为背景，用正交试验法对竹大片刨花板的关键性工艺参数刨花厚度，用胶量和热压温度作优化试验。试验结果表明，在适当的工艺条件下。Based on the outcomes from the pre-experiments,the glued structure of randomlymatted wafers and the general procedures with a series of related parameters,such keyprocessing parameters as the thickness of the wafer,glue content and temperature duringhot-pressing are optimized in this study to support the reliable basic technology theory forindustrial production of bamboo-based waferboard.Results from the comprehensiveorthogonal experiment show that bamboo-based waferboard with equal quality to woodyones can be made under proper technological conditions.

关 键 词：板材 竹人造板 大片刨花板 工艺参数 

分 类 号：TS653.5[轻工技术与工程]