扩散硅力敏器件CAD技术的研究——结构应力分析  

A Study of CAD Techniques for Silicon Pressure Sensors

作　　者：唐桢安[1] 吴坚民 吴静[1] 

机构地区：[1]大连理工大学电子工程系,辽宁省大连市116024

出　　处：《仪表技术与传感器》1995年第5期8-10,16,共4页Instrument Technique and Sensor

摘　　要：本文介绍在IBM系列及其兼容系列微型机上,实现硅压力传感器中硅杯结构的应力分析方法和软件.该软件对微机软、硬件资源的要求很低,能对包括工艺误差在内的各种复杂的硅杯结构绘出准确的应力分析图.This paper introduces a new method and a software for stress analysis of silicon pressure sensors. The software that is suitable for IBM series and their compatible computershas low requirement of software and hardware resources, but can produce accurately stress graph for various complicat-ed structures of silicon pressure sensors, even taking consideration of process errors.

关 键 词：硅压力传感器 CAD 微机 传感器 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]