铜在铁基体上电沉积过程研究  

STUDY OF THE PROCESS OF COPPER-PLATING ON BASE-METAL IRON

作　　者：王朝敏[1] 冯绍彬[1] 

机构地区：[1]河南师范大学,郑州轻工业学院

出　　处：《应用科学学报》1995年第1期69-73,共5页Journal of Applied Sciences

摘　　要：采用恒电流法和循环伏安法研究了铁电极在镀铜电解液中的电化学行为。证明了具有良好结合强度的电镀过程应该是电极首先极化至铁表面钝态层的还原电位，实现基体表面的后化；随后继续极化至金属镀层的析出电位，使电镀层沉积在已活化的铁表面。In this paper,the process of copper metal electrodeposit in the electrolysisbath was studied by the constant current and the encircled volt-ampere methods.it was observed that the iron electrode surface was first activated and then themetal was separated out along with potential negative shifting.Thus the highstrength combination between the plating deposit and the iron substrate is achieved.

关 键 词：电沉积 电化学 铁基体 镀铜 

分 类 号：TQ153.14[化学工程—电化学工业]