Ag的添加量对Sn-9Zn无铅钎料性能的影响(英文)  

Effects of Ag on Properties of Sn-9Zn Lead-Free Solder

作　　者：陈文学 薛松柏 王慧 胡玉华 

机构地区：[1]Nanjing Univ Aeronaut & Astronaut, Coll Mat Sci & Technol, Nanjing 210016, Peoples R China

出　　处：《稀有金属材料与工程》2010年第10期1702-1706,共5页Rare Metal Materials and Engineering

基　　金：Jiangsu Six Kind Skilled Personnel Project (06-E020)

摘　　要：研究Ag的添加量对Sn-9Zn无铅钎料性能的影响规律。结果表明,Ag不仅对Sn-9Zn无铅钎料的润湿性能和显微组织有明显作用,而且对钎料接头的力学性能也有较大的影响。添加0.3%Ag(质量分数,下同)后,钎料的抗氧化性能得到提高,因此钎料的润湿性能得到改善。Sn-9Zn-0.3Ag具有比Sn-9Zn钎料更均匀的组织。研究结果还表明,添加0.3%Ag后,钎料接头的力学性能最佳,接头断口显示有大量的细小均匀的韧窝组织。当Ag的添加量添加到1%时,在韧窝底部出现Cu-Zn、Ag-Zn金属间化合物,此时,接头力学性能下降。The influences of different Ag contents on the properties of Sn-9Zn lead-free solder were investigated. The results indicate that Ag plays an important role not only in the solderability and the structure of the solder, but also in the mechanical property of the soldered joint. In particular, adding 0.3% (mass fraction) Ag can improve the oxidation resistance of the solder, so the solderability of the solder is significantly improved. Sn-9Zn-0.3Ag shows finer and more uniform microstructure than Sn-9Zn. Results also indicate that when the content of Ag is 0.3%, the best mechanical property of the soldered joint can be obtained, and the fracture micrographs show that plenty of small and uniform dimples are found on the soldered joints fractures. Some Cu-Zn and Ag-Zn intermetallic compounds appear at the bottom of dimples when the content of Ag is up to 1%, and the mechanical property of the soldered joint is reduced.

关 键 词：添加量 无铅钎料 钎料性能 mechanical property 接头力学性能 INTERMETALLIC compounds oxidation resistance 润湿性能 soldered joints results microstructure 显微组织 金属间化合物 抗氧化性能 influences different 质量分数 影响规律 结果 fracture 

分 类 号：TG425[金属学及工艺—焊接]