Ti对金属间化合物增强陶瓷钎焊接头组织与性能的影响  

Effect of Ti on the microstructures and properties of ceramic bonded joints with intermetallic compounds

作　　者：张德库[1] 邹贵生[1] 吴爱萍[1] 刘根茂[1] 

机构地区：[1]清华大学机械工程系,北京100084

出　　处：《焊接学报》2005年第8期9-11,共3页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(50075046)

摘　　要：利用Ag-Cu-Ti加Ni、Ti复合中间层钎焊技术连接Si3N4陶瓷,通过原位生成金属间化合物的方法,增强钎缝。结果表明,Ti箔厚度对接头的组织及性能都有重要的影响。Ti箔的厚度对接头组织的影响主要体现在钎缝组织和界面反应层结构。Ti箔的厚度较小时,有利于金属间化合物的形态及分布,但是不利于形成有效的反应层。Ti箔厚度过大时,则对金属间化合物的形态、分布以及界面反应层均产生不利的影响。In this paper, Si_3N_4 Ceramics were bonded with Ag-Cu-Ti and Ti/Ni/Ti multi-interlayer. The joints were strengthened by intermetallic compounds formed in situ. The results showed that the thickness of Ti foil has an important influence on the microstructures, properties of joints, and status of interfacial reaction layer. Thin Ti foil is favorable for form and distribution of intermetallic compounds, but harmful for formation of interfacial reaction layer. While thick Ti foil has adverse effect on form and distribution of intermetallic compounds and interfacial reaction layer.

关 键 词：SI3N4 金属间化合物 原位 钎焊 

分 类 号：TG454[金属学及工艺—焊接]