Ni-P化学镀层相变过程研究  

Investigation of Phase Transformation Process in Electroless Plating Ni-P Film

作　　者：卫英慧[1] 毕虎才[1] 侯利锋[1] 胡兰青[1] 许并社[1] 市野濑英喜2 

机构地区：[1]太原理工大学材料科学与工程学院,山西太原030024

出　　处：《太原理工大学学报》2005年第5期567-570,共4页Journal of Taiyuan University of Technology

基　　金：国家自然科学基金资助项目(50471070);教育部跨世纪人才支持计划;山西省青年学科带头人基金和山西省青年科技基金资助项目(20041023)

摘　　要：针对镍磷化学镀镀层相变过程中存在的问题,通过X射线衍射、差热分析和透射电镜等手段对含磷原子数分数12.15%的镍磷镀层的镀态组织和晶化过程进行了初步研究。结果表明,这种中磷含量的镍磷镀层镀态下组织为非晶态,晶化起始温度321℃;退火过程中,非晶组织中先形成镍纳米晶,然后纳米晶镍伴随晶化过程进行迅速长大,并在镍基体上析出亚稳过渡相Ni12P5和稳定的Ni3P相,400℃退火90min后的组织为晶粒尺寸为微米级的镍基体上分布着弥散的Ni3P相和少量的Ni12P5相。Focusing on complicated phase transtormation,the authors investigated the microstructures and crystallization process of electroless plating Ni-P film with 12.15% phosphorus by means of XRD, DSC and TEM etc. It concluded that the film with medium phosphorus content consists of amorphous microstructure. Crystallization process of the microstructure begins at 321℃. Nanocrystalline nickels form firstly in the amorphous during annealed. The grain sizes of the nickels become promptly larger with crystallization in progress. Thereafter metastable Ni12P5 phases and stable Ni3P phases precipitate out in the nickel matrix in sequence. Microstructures of the annealed at 400℃ for 90 min consist of the nickel matrix in micro size, Ni3P phases and a little of Ni12P5 phases.

关 键 词：化学镀 镍磷 相变 

分 类 号：TQ153.2[化学工程—电化学工业]