合金元素对Sn-Bi-Sb-Ag-Cu-Re系无铅钎料性能和组织的影响  

Effect of alloying elements on properties and microstructure of Sn-Bi-Sb-Ag-Cu-Re lead-free solder

作　　者：王宗杰[1] 路林[1] 王敏[1] 

机构地区：[1]沈阳工业大学材料科学与工程学院,沈阳110023

出　　处：《沈阳工业大学学报》2005年第4期377-380,共4页Journal of Shenyang University of Technology

基　　金：辽宁省教育厅攻关项目(20142210)

摘　　要：研究了合金元素Bi、Sb、Ag、Cu、Re对锡基无铅多元钎料性能和组织的影响.研究结果表明,增加Bi、Ag、Cu含量可以降低液相线温度,Sb可以提高液相线温度;Bi、Cu有提高润湿性能的作用,Sb、Ag、Re在低含量范围内可提高润湿性能;Cu有提高剪切强度的作用,Bi明显使剪切强度降低.钎料的相组成是由在-βSn的基体上分布着金属间化合物Ag3Sn、SnBi和Cu6Sn5构成的,Sb和Re则基本上是固溶在基体中.The effect of Bi,Sb, Ag, Cu and Re on the properties and microstructure of Sn-Bi-Sb-Ag-Cu-Re lead-free solder is studied. The results of experiment show that in the studied composition range, Bi,Ag and Cu can decrease melting temperature with an increase in their content, Sb can increase melting temperature; Bi and Cu can increase the wettability, low content of Sb,Ag and Re can increase the wettability; Cu can increase the shear strength, Bi can decrease the shear strength obviously. Such intermetalic compounds as SnBi,Ag3Sn and Cu6Sn5 were found in the lead-free solders while Sb and Re were dissolve into Sn base.

关 键 词：无铅钎料 合金元素 熔化温度 润湿性 剪切强度 组织 

分 类 号：TG454[金属学及工艺—焊接]