铜箔表面粗化工艺的研究  

Study on Copper Foil Surface Roughening Technology

作　　者：张世超[1] 石伟玉[1] 白致铭[1] 

机构地区：[1]北京航空航天大学材料科学与工程学院,北京100083

出　　处：《电镀与精饰》2005年第5期1-3,共3页Plating & Finishing

基　　金：国家高技术研究发展计划(863计划)(2002AA302402)

摘　　要：对铜箔表面进行粗化处理,传统的粗化工艺中要使用砷化物,不仅操作不便而且危害环境。研究了硫酸钛和钨酸钠在铜箔粗化过程的作用,发现二者共同作用可以在不使用砷化物的情况下,通过电沉积得到理想的粗化层,表面粗糙度可提高200%。Copper foil is used widely in electronic industries and has been employed as a material for producing printed wiring board and lithium ion batteries. Before it is used, copper foil should be subjected to an electrochemical surface treatment to improve its bond strength. Traditional copper surface roughening treatment involve the use of arsenide-containing electrolyte which is harmful to environment. A process of treating the surface of copper foil in an electrolytic bath containing TiSO4 and Na2WO4 without using harmful arsenide was investigated. Through abovementioned treatment, a uniform rough layer with high value of Ra can be produced.

关 键 词：铜箔 粗化 表面粗糙度 砷化物 

分 类 号：TG178[金属学及工艺—金属表面处理]