半导体激光焊接系统的特点及其在无铅软钎焊中的应用  

CHARACTERISTIC OF DIODE-LASER SOLDERING SYSTEM AND ITS APPLICATION IN LEAD-FREE SOLDERING

作　　者：姚立华[1] 薛松柏[1] 刘琳[1] 

机构地区：[1]南京航空航天大学,210016

出　　处：《焊接》2005年第8期40-44,共5页Welding & Joining

摘　　要：分析比较了固体激光软钎焊系统和半导体激光软钎焊系统的优缺点,介绍了采用半导体激光器作为热源用于无铅软钎焊的工艺特点和钎焊机理、激光参数对软钎焊焊点质量的影响因素,以及半导体激光软钎焊技术的应用和发展趋势。The advantage and disadvantage of solid laser soldering system and diode - laser soldering system were analyzed in this paper. Technological characteristics and soldering mechanism of lead - free soldering using diode - laser as heat source were introduced. Influences of laser parameters on soldered joint quality, and the application and development of diode - laser soldering were also discussed briefly.

关 键 词：半导体激光器 无铅软钎焊 焊点质量 激光焊接系统 激光软钎焊 工艺特点 应用 无铅 钎焊机理 激光参数 

分 类 号：TG717.05[金属学及工艺—刀具与模具] TN248.4[电子电信—物理电子学]