咪唑类潜伏性固化剂  

Imidazole Type Latent Curing Agent

作　　者：张健[1] 韩孝族[1] 

机构地区：[1]中国科学院长春应用化学研究所,吉林长春130022

出　　处：《化学与粘合》2005年第5期294-298,共5页Chemistry and Adhesion

摘　　要：微电子封装技术是一项重要的技术,这项技术直接影响最终电子产品的性能、外形尺寸、价格及可靠性能。要发展高性能、超小型/高密度、低能耗、多功能、高速信号处理和长期可靠性的电子产品,就离不开微电子封装技术。封装材料目前大多使用咪唑类潜伏性固化剂,咪唑类潜伏性固化剂对微电子封装而言非常重要,本文介绍咪唑类潜伏性固化剂的制备方法,以及在电子封装方面的一些应用实例,并对潜伏性固化机理进行扼要的探讨。The microelectronic packaging technology, is an important technology that affects performance, size, price and reliability of final electronic products. The importance of this technology, is being emphasized according to the development of electronic products pursuing high electric performance, ultra small size/high density, low power, multi - function, high speed signal processing and permanent reliability. Imidazole latent hardeners are mostly utilized in the materials. The prepatation of imidazole latent curing agent and some application instances for dectronic package are rveiewed and the lstent curing mechanism of hardener is discussed in hid in this paper.

关 键 词：咪唑 潜伏性固化 电子封装 

分 类 号：TQ314.256[化学工程—高聚物工业]