CuCr触头材料纳米晶化对真空放电性能的影响  

Effects of nanocrystallization of CuCr contact materials on characteristics of vacuum discharge

作　　者：冯宇[1] 张程煜[2] 杨志懋[1] 王亚平[3] 丁秉钧[1] 

机构地区：[1]西安交通大学理学院,陕西西安710049 [2]清华大学机械工程系,北京100084 [3]中国科学院金属研究所,辽宁沈阳110016

出　　处：《兵器材料科学与工程》2005年第5期19-22,共4页Ordnance Material Science and Engineering

基　　金：国家自然科学基金资助(资助号:50071043;50271050)

摘　　要：研究了纳米晶CuCr25和CuCr50触头材料在峰值电流为10A时,真空电弧的截流值、稳定性及其寿命。结果表明,纳米晶CuCr合金的真空电弧稳定性要高于其常规合金,纳米晶CuCr合金截流值远小于常规合金的截流值。从理论分析可得出,纳米晶CuCr合金的蒸汽压为其常规合金蒸汽压的10倍多。由于蒸汽压与电弧放电特性密切相关,所以CuCr触头材料纳米晶化可以有效地增加电弧稳定性和降低材料的截流值。This paper studys the chopping current, stability and lifetime of the vacuum arc of nanocrystalline CuCr25 contact materials and CuCr50 contact materials when the peak current is in 10 A. The results show that the vacuum arc of nanocrystalline CuCr is more stable than that of conventional materials, the chopping current of nanocrystalline CuCr alloys is smaller than that of conventional alloys. Through theoretical analysis, we can know that the saturated steam pressure of nanocrystalline CuCr alloys is about 10 times that of conventional alloys. Nanocrystallization of CuCr alloys can effectively increase stability and lower chopping current.

关 键 词：纳米材料 CUCR触头材料 截流值 饱和蒸汽压 

分 类 号：TM201.44[一般工业技术—材料科学与工程]