粉状酚醛树脂竹大片刨花板的生产工艺  

Manufacturing Technology of Bamboo-based Waferboard with Powdered Phenol-Formaldehyde Resin Adhesives

作　　者：郑志锋[1] 张宏健[1] 温明明[1] 唐荣燕[1] 员永生[1] 

机构地区：[1]西南林学院木材工业研究所,昆明650224

出　　处：《木材工业》2005年第5期10-12,共3页China Wood Industry

摘　　要：试验确定粉状酚醛树脂竹大片刨花板的较佳制板工艺条件为:板材密度压缩比1:1.4(密度为0.86 g/cm3),施胶量3.5%,刨花含水率12%,热压温度(165±5)℃,闭合速度12.5 mm/s,热压时间1.35～1.45 min/mm板厚,压力8.75 MPa.按以上工艺条件制备的板材性能达到或超过加拿大CAN 3-O437.0-M85相关要求.A series of experiments on determination of manufacturing technology for bamboo-based waferboard bonded with powdered phenol-formaldehyde （PF） resin were conducted by the authors. The optimum parameters obtained though the experiments were as follows： mat compression ratio at 1 ： 1.4 （board density 0. 86 g/cm^3）, glue consumption of 3. 5%, wafer moisture content 12%after resin application, and hot pressing at （165±5）℃ and 8. 75 MPa, with closing speed at 12.5 mm/s, and pressing time at 1.35-1.45 min/mm. Waferboard made under the above conditions have excellent properties equal or even superior to the requirements of Canadian Standard CAN 3-O437.0-M85.

关 键 词：竹大片刨花板 粉状酚醛树脂 含水率 施胶量 

分 类 号：TS653.5[轻工技术与工程]