热环境下贴压电层的功能梯度材料板的自由振动和动力响应  

Free Vibration and Dynamic Response of Functionally Graded Plates with Piezoelectric Layers in Thermal Environments

作　　者：黄小林[1] 沈惠申[1] 

机构地区：[1]上海交通大学

出　　处：《应用力学学报》2005年第3期456-460,511,共5页Chinese Journal of Applied Mechanics

基　　金：国家自然科学基金项目(50375091)

摘　　要：基于Reddy高阶剪切变形理论和广义Kármán型方程,用双重Fourier级数展开法求得了热环境下带压电层的功能梯度复合材料混合层合板的自由振动及动力响应的解析解,分析中考虑了材料热物参数对温度变化的依赖性,讨论了环境温度和控制电压对固有频率及动力响应的影响。Based on Reddy higher-order shear deformation plate theory and general von Karman-type equations, the analytical solutions for free vibration and dynamic response of simply supported functionally graded plates with piezoelectric layers in thermal environments are described with double Fourier series, where temperature-dependent material properties are taken into account. The effects of thermal environments and applied voltage on natural frequencies and dynamic response of the plate are investigated.

关 键 词：功能梯度材料 压电材料 混合层合板 固有频率 动力响应 

分 类 号：O321[理学—一般力学与力学基础]