光电耦合器的结构设计及封装胶特性分析  

The Structure Design of Optocoupler and Characteristic Analysis of Its Package Resin

作　　者：田浦延[1] 陈蒲生[1] 

机构地区：[1]华南理工大学应用物理系,广州510640

出　　处：《固体电子学研究与进展》2005年第3期340-343,397,共5页Research & Progress of SSE

摘　　要：研究了光电耦合器的结构设计,分析了光耦器件的两种不同光传输结构,讨论了重要参数CTR和BV随绝缘距离的变化以及BV与封装尺寸的关系。分析了用于不同光传输结构光耦的内外封装胶特性,对几种不同的封装胶通过光谱测试实验讨论其成分与特性。An analysis is made on the structural design of optocoupler, including two kinds of infrared transfer structure, and the characteristic of package resins which are used in optocoupler to different transmission structures. The influence of insulation thickness to CTR and BV, of package dimension to BV is discussed. And the spctral analysis, element analysis, and characteristic analysis about package resin are made too.

关 键 词：光电耦合器 电流传输比 绝缘电压 绝缘距离 发光二极管 封装胶 

分 类 号：TN36[电子电信—物理电子学] TN203