BGA封装锡球制备技术研究  

Research on Technology of Fabricating Solder Ball for BGA Packaging

作　　者：高德云[1] 夏志东[1] 雷永平[1] 史耀武[1] 

机构地区：[1]北京工业大学材料科学与工程学院,北京100022

出　　处：《电子元件与材料》2005年第10期56-60,共5页Electronic Components And Materials

基　　金：国家863计划资助项目(No.2002AA322040);北京市教育委员会资助项目(No.2002KJ020);北京市自然科学基金资助项目(012003)

摘　　要：综合介绍了BGA封装使用锡球常用制造方法,分析了研究较多的均匀颗粒成型技术的原理。用均匀液滴法制备的BGA锡球颗粒具有真圆度高,表面质量好,颗粒粒度均匀等特点,能直接得到满足使用要求的锡球,生产效率远胜于传统生产技术。重点介绍均匀颗粒成型的几种实现方法及特点,其中AC-DC雾化法具有实现方式简单,成型优异的特点。Fabricating methods often used for solder ball in the BGA package were reviewed. UDS （uniform droplet spray）, which is widely investigated was analyzed. UDS fabricated particles are with characteristics of good roundness, better exterior quality and monodispersity, and the quality is better than ones produced by traditional technologies, particularly in productivity. A few of UDS methods and their feature are particularly pointed out. Among them the AC-DC spraying method is with fabricating simplification and high shaping quality.

关 键 词：电子技术 锡球 综述 BGA 制备技术 均匀颗粒 

分 类 号：TG42[金属学及工艺—焊接]