新型Sn-Ag-Cu-Cr无铅焊料合金的研究  

A New Type Sn-Ag-Cu-Cr Lead-free Solder

作　　者：张富文[1] 刘静[1] 杨福宝[1] 胡强[1] 贺会军[2] 朱学新[1] 徐骏[1] 石力开[1] 

机构地区：[1]北京有色金属研究总院,北京100088 [2]北京康普锡威焊料有限公司,北京100088

出　　处：《电子元件与材料》2005年第11期45-48,共4页Electronic Components And Materials

基　　金：国家863计划资助项目(2003AA3Z1420)

摘　　要：对新型Sn-Ag-Cu-Cr无铅焊料进行了熔点、力学性能、润湿性能等的测试,并从微观方面分析了Cr对Sn-Ag-Cu系无铅焊料的作用规律机理。结果表明:Cr的加入对材料力学性能的影响较为显著,当Cr含量(质量分数)在0.1%左右时可提高焊料的各项力学性能指标,而当含量过高后,又将降低材料的强度,提高脆性,Cr含量少于0.5%时,对焊料的熔点影响较小,而Cr的加入对焊料的铺展性能却有降低作用。The Sn-Ag-Cu solder was researched. Specially, the melting point, mechanical properties and wetting property was analyzed. Furthermore, the effect mechanism of Cr element was analyzed from the microstructure. The results show that Cr-element affects the lead-free solder on mechanical property in particularly. While the w（Cr） is about 0,1%, the alloy shows the best strength and elongation which is obviously superior to Sn-Ag-Cu solder. However, above the critical value content, property may be deteriorated. And the high Cr content alloys exhibit the more fragility. Additionally, the Cr affects the melting point slightly while the w（Cr） is below 0.5%, and it can reduce the spreading area by reason of the oxidization.

关 键 词：金属材料 无铅焊料 Sn—Ag-Cu—Cr熔点 力学性能 润湿性 

分 类 号：TN604[电子电信—电路与系统]