Sn-Ag-Cu无铅焊料的发展现状与展望  

Developing Tendency and Current Situation of Sn-Ag-Cu Lead-Free Solder

作　　者：张富文[1] 刘静[1] 杨福宝[1] 胡强[1] 贺会军[2] 徐骏[1] 

机构地区：[1]北京有色金属研究总院国家复合材料工程技术研究中心,北京100088 [2]北京康普锡威焊料有限公司,北京100088

出　　处：《稀有金属》2005年第5期619-624,共6页Chinese Journal of Rare Metals

基　　金：国家"863"计划资助项目(2003AA3Z1420)

摘　　要：Sn-Ag-Cu系无铅焊料由于具有良好的焊接性能和使用性能,已逐渐成为一种通用电子无铅焊料;综述了Sn-Ag-Cu系焊料从无到有、从二元发展至三元乃至多元的发展历程,及其研究现状和当前应用较多的几个典型成分的各自应用水平,对当前Sn-Ag-Cu系焊料的熔化温度、润湿性、组织结构和力学性能研究方面以及存在的超电势问题、抗氧化和抗腐蚀性不足、使用的可靠性等主要问题作了总结,并根据国情对其在国内外的发展前景作了预测和展望,提出在发展无铅焊料过程中需要着重注意研究的几个方面,并指出今后较长一段时间内不会出现某一种无铅焊料能像Sn-Pb系那样独断电子封装行业的状态。With the establishment of green lead-free solder legislation （ WEE/RoHS ）, which declared by US, Japan and EU, more and more countries and companies are engaging in R＆D of lead-free solder. Because of the excellent welding property and favorable stability, Sn-Ag-Cu system lead-free solders are becoming normal solders, now. The developing of the solder composites appearance from binary to ternary and the characters of its main representative alloys are reviewed at this paper. Besides, the studying emphases of its properties, such as melting point, wettability and stability, together with its anti-oxidization and anti-corrosive defects are summarized in detail. Further more, the Pb-free solder development in China is proposed and scheduled according to the environment of China, as well as some aspects should be pay more attention during research. In the author＇s opinion, there will not appear any one kind of lead-free solders entirely replacing Sn-Pb solders in a shot time.

关 键 词：无铅焊料 Sn—Ag—Cu 性能 电子材料 

分 类 号：TG1[金属学及工艺—金属学]