化学镀Ni-W-P镀液及工艺优化研究  

Optimization of electroless Ni-W-P plating process

作　　者：许晓丽[1] 黄燕滨[1] 张平[1] 孟昭福[2] 梁志杰[1] 刘德刚[1] 刘波[1] 

机构地区：[1]装甲兵工程学院材料科学与工程系,北京100072 [2]装甲兵工程学院外训系,北京100072

出　　处：《电镀与涂饰》2005年第2期18-20,共3页Electroplating & Finishing

摘　　要：采用正交试验,以镀层的耐硝酸变色时间为评价标准,得到化学镀Ni-W-P溶液最佳配方为:20 g／L硫酸 镍、20 g／L钨酸钠、20 g／L次磷酸钠、40 g／L络合剂、20 g／L缓冲剂、pH值为6。对该优化镀层的沉积速度、耐蚀性、孔隙率 及结合力进行了测定,并与Ni-P二元合金镀层进行了比较。结果表明,该优化镀层的性能优于Ni-P二元合金。采用扫描电 镜及X-射线衍射仪分别对该优化镀层的微观形貌、组成及结构进行的分析表明,该镀层结构致密,磷含量高达13.9％,且 为非晶态结构。By an orthogonal test and with the tarnish time of resistance to nitric acid as evaluation criterion, the optimal formula of electroless Ni-W-P plating bath was obtained as follows： 20 g/ L of nickel sulfate, 20 g/ L of sodium tungstate, 20 g/L of sodium hypophosphite, 40 g/L of complexant, 20 g/L of buffering agent and pH value of 6. The deposition rate, corrosion reistance, porosity and adhesion of the coatings deposited from the optimal bath were determined and compared with those of Ni-P alloy deposits. The results show that the properties of the optimized coatings are superior to those of Ni-P alloy coatings. The SEM and XRD analysis on the micro-morphology, composition and structure of the optimized deposits demonstrates that the optimized Ni-W-P alloy coatings have dense and amorphous structure and 13.9% of phosphorus by weight.

关 键 词：化学镀 NI-W-P合金 正交试验 耐蚀性 

分 类 号：TG178[金属学及工艺—金属表面处理]