无铅电子封装焊料的研究现状与展望  

Developing Tendency and Current Situation of Lead-free Solder

作　　者：张富文[1,2] 刘静[1] 杨福宝[1] 贺会军[2] 胡强[1,2] 朱学新[1] 徐骏[1,2] 石力开[1] 

机构地区：[1]北京有色金属研究总院,北京100088 [2]北京康普锡威焊料有限公司

出　　处：《材料导报》2005年第11期47-49,64,共4页Materials Reports

基　　金：国家863计划项目(2002AA322040)

摘　　要：随着关、日和欧盟就含铅钎料建立相应立法之后,各国都在紧锣密鼓地开展绿色环保无铅产品的研发工作。介绍了国内外无铅焊料所涉及的4种主要成分设计方法,以及当前研究的主要无铅体系及其各自特征;论述了各焊料体系所应用的范围、组织结构和性能,及无铅焊料所关注的主要性能指标和发展趋势,并结合我国国情展望了我国无铅焊料的前进方向。With the establishment of green lead-free solder legislation, which declared by US, Japan and EU, more and more countries and companies are engaging in R＆D of lead-free solder. This paper reviews the development of lead-free solder, and analyses several main lead-free solder＇s properties and application field. It also reviews some common reliability problem, developing requirement and tendency of lead-free solder alloy. Further more, the lead-free solder development in China is proposed according to the abundant tin resource of China.

关 键 词：无铅焊料 电子封装性能 

分 类 号：TG[金属学及工艺]