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机构地区:[1]华中科技大学电子科学与技术系,武汉430074
出 处:《材料导报》2005年第F11期280-282,289,共4页Materials Reports
基 金:国家“863”计划资助项目(2001AA320504)
摘 要:主要介绍了环保型导电浆料开发应用的目的和意义,阐述了烧渗导电浆料与低温固化导电胶向绿色环保方向发展的最新进展及存在的问题。烧渗导电浆料目前主要是向无铅化发展,对于烧结温度低于550℃浆料的无铅化还有很大困难,主要问题是无铅玻璃料的软化温度较高、化学稳定性较差。导电胶主要是向贱金属、耐高温、增加导电率等方向发展,存在的问题是其可靠性和化学稳定性较差。最后还对环保型导体浆料的发展进行了总结和展望。In this paper, the aim and significance of developing environment-protecting conductive pastes are introduced. The new progresses and existing problems of the sintered conductive pastes and the low temperature solidified conductive adhesives are also described. The development of the sintered conductive pastes is towards lead-free, and there are some difficulties for low sintered temperature, especially when the sintered temperature is lower than 550℃. The main problem is that the melting point of leadfree glass frit is too high and the chemical stability is poor. Meantime, the developing trend of the electrical conductive adhesive is to use low price metals, with high temperature stability and to improve conductivity. The main exiting problems now are it's reliability and chemical stability. Finally, the conclusions and prospects of the environmental conductive pastes are given in this paper.
分 类 号:TQ171.734[化学工程—玻璃工业] TM24[化学工程—硅酸盐工业]
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