IC芯片粘片机并联焊头机构的运动学分析  

Kinematics analysis on parallel welding head mechanism of IC chip pasting machine

作　　者：彭卫东[1] 陈新[1] 李克天[1] 郑德涛[1] 敖银辉[1] 

机构地区：[1]广东工业大学机电工程学院

出　　处：《机械设计》2005年第12期19-21,共3页Journal of Machine Design

基　　金：国家自然科学基金(50475044);教育部科技研究重点项目(2004106);高等学校博士学科点专项科研基金(20040562005);广东省自然科学基金(04300155);广州市科技攻关资助项目(2003Z2-D9021;2004Z3-D9021)

摘　　要：针对所设计的IC芯片粘片机的并联焊头机构,建立了运动方程,给出了运动方程的正解,推导出速度、加速度的正、逆解。在已知左右驱动电机运动规律的情况下,使用Matlab软件得出了该机构X,Y方向的速度、加速度曲线和位移曲线。研究结果表明,该机构运动平稳,位移曲线与预计的轨迹相符,能够满足工作要求。Directed against the designed parallel welding head mechanism of IC chip pasting machine, the movement equation was established, the positive solution of motion equation was presented, and the positive and reverse solutions of velocity and acceleration were derived. Under the situation of knowing the motion law of left and right driving motors and using the Matlah software, the velocity and acceleration curves and displacement curves in the X,Y directions of this mechanism were obtained. The result of research shows that the motion of this mechanism is steady, the displacement curve tallies with the predicted track and can satisfy the requirement of work.

关 键 词：并联焊头机构 运动方程 加速度曲线 位移曲线 

分 类 号：TH112[机械工程—机械设计及理论]