多元无铅软钎料的计算机优化设计  

Optimal design of multi-element lead-free soft solder with computer

作　　者：王宗杰[1] 路林[1] 王敏[1] 常云龙[1] 

机构地区：[1]沈阳工业大学材料科学与工程学院,沈阳110023

出　　处：《沈阳工业大学学报》2005年第6期615-618,共4页Journal of Shenyang University of Technology

基　　金：辽宁省教育厅重点攻关项目(20142210)

摘　　要：利用二次回归正交设计法得到27组试验钎料配方,分别测定了它们的液相线温度和润湿性;选取液相线温度和润湿性的试验数据作为参数,依据回归设计理论,通过计算机辅助设计,建立了钎料的液相线温度、润湿性与Bi、Sb、Ag、Cu、Re之间关系的二次回归方程;根据最优化原理,通过建立数学模型和计算机优化运算,得到了Sn-Bi-Sb-Ag-Cu-Re系优化钎料.试验结果表明,Sn-Bi-Sb-Ag-Cu-Re系优化钎料的熔化温度和润湿性均比较好.27 prescriptions of experimental solders liquid phase line temperature and wettability are are fixed through quadratic regressive orthogonal design. Their measured separately. Choosing the experimental data of liquid phase line temperature and wettability as parameters, th （Bi, Sb, Ag, Cu, Re） and performance are determined e quadratic regression equations on five alloying elements through computer-aided design. According to optimization theory and through establishing mathematics model and utilizing computer program, the optimum solder composed of Sn-Bi-Sb-Ag-Cu-Re is attained. The experimental results show that melting temperature and wettability of the optimum solder are better.

关 键 词：无铅钎料 优化设计 润湿性 熔化温度 正交回归 

分 类 号：TG454[金属学及工艺—焊接]