锌溶液催化印制板铜箔化学镀镍  

Electroless nickel plating on PCB copper foil catalyzed by zinc solution

作　　者：陈智栋[1] 何万强[1] 林西平[1] 

机构地区：[1]江苏工业学院,江苏常州213016

出　　处：《电镀与涂饰》2005年第12期22-24,共3页Electroplating & Finishing

摘　　要：采用锌溶液代替钯溶液作为印制板铜箔化学镀镍前的催化处理液。考察了锌催化时间、催化温度对化学镀镍的影响。锌催化溶液组成为115 g/L硫酸锌、19 g/L DL-苹果酸钠、25 g/L锌粉,催化温度60℃,催化时间1 m in。采用SEM、EDS等实验手段分析了化学镀镍层的断面形貌和剥离强度。经锌溶液催化的铜箔表面可以成功地进行化学镀镍,且镀镍层有良好的剥离强度,实验速率为50 mm/m in下的剥离强度为10.6 kg。Zinc solution as a replacement of palladium solution was used to catalyze PCB copper foil before eletroless nickel plating. Influences of zinc catalyzing time and temperature on electroless nickel plating were investigated. Zinc catalyzing solution was composed of 115 g/L zinc sulfate, 19 g/L sodium DL-malate and 25 g/L zinc powder with catalyzing time of l h and temperature of 60 ℃. The section morphology and peeling intensity of electroless nickel deposit were analyzed by means of SEM and EDS. After zinc solution catalysis the surface of copper foil can be treated successfully with electroless nickel plating, and the obtained nickel deposit has good peeling intensity of 10.6 kg at experimental speed of 50 mm/min.

关 键 词：化学镀镍 锌溶液 催化 铜箔 

分 类 号：TQ153.12[化学工程—电化学工业]