BCN薄膜的硬度和剩余应力的研究  

Hardness and Residual Stress in BCN Coatings

作　　者：孙雅琴[1] 严少平[1] 

机构地区：[1]安徽理工大学数理系,安徽淮南232001

出　　处：《安徽理工大学学报（自然科学版）》2005年第4期91-93,共3页Journal of Anhui University of Science and Technology:Natural Science

摘　　要：类金刚石结构的立方“BCN”材料由于兼有金刚石和立方氮化硼超硬、低摩擦的优点, 如有低摩抗磨、高的热稳定性和化学稳定性,并克服了它们的缺点,因而BCN薄膜材料被作为耐磨保护层,在电学、光学方面的性能也得到广泛应用。应用反应磁控溅射法将高质量的BCN 薄膜沉淀在硅基底上,通过用微压痕测量和弯曲技术研究了他们硬度和剩余应力,发现施于薄膜沉淀物上的偏压对其硬度和剩余应力均有重要影响。Cubic Diamond-like carbon structural materials of boron nitride carbon thin films have the advantage of diamond films and Cubic boron nitride （c-BN） film, such as a low friction, high abrasive resistance, large chemical and thermal stability. As a result, the BCN thin film material has been used as wearing layer,and applied in the electronic and optical fields. High quality boron nitride carbon thin films were deposited on c-Si substrates by using reactive magnetron sputtering. Their mechanical properties, including hardness and residual stress, were investigated by using microindentation measurements and a bending technique. It is observed that the bias voltage applied for the thin film deposition has a significant influence both to the hardness and residual stress.

关 键 词：射频磁控溅射 BCN薄膜 硬度和剩余应力 偏压 

分 类 号：TB43[一般工业技术]