半导体激光工艺参数对Sn-Ag-Cu钎料润湿性影响分析  

Effects of diode laser soldering parameters on wettability of Sn-Ag-Cu solder

作　　者：薛松柏[1] 姚立华[1] 韩宗杰[1] 刘琳[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《焊接学报》2005年第12期39-42,共4页Transactions of The China Welding Institution

基　　金：南京航空航天大学引进入才科研基金项目(S0462-061)

摘　　要：采用半导体激光软钎焊系统对Sn96Ag3.5Cu0.5钎料和Sn63Pb37钎料进行了润湿性对比试验研究,分析了激光输出功率对钎料润湿性的影响规律。结果表明,提高半导体激光的输出功率,在一定范围内能显著改善Sn96Ag3.5Cu0.5钎料和Sn63Pb37钎料的润湿性。根据钎料的合金成分及钎料膏中钎剂成分的不同,优化半导体激光钎焊工艺参数,可以达到最佳的钎焊效果。Diode laser soldering system was used to study and explore the ways to improve the wettability of Sn96Ag3.5Cu0.5 lead-free solder and Sn63Pb37 solder in the contrast experiments, the effects of laser output power on the wettability of solders on copper were also analyzed in this paper. Results indicate that increasing diode laser output power can greatly improve the wettability of Sn96Ag3.5Cu0.5 lead-free solder and Sn63Pb37 solder in a certain range. According to different alloy components and flux components in the solder pastes, optimizing laser soldering parameters, the optimal soldered joints can be obtained and the results will provide a novel method for improving the wettability of Sn96Ag3.5Cu0.5 lead-free solder.

关 键 词：半导体激光软钎焊 润湿性 工艺参数 

分 类 号：TG456[金属学及工艺—焊接]