金刚石刻蚀技术研究  

Research on Etching Technologies of Diamond

作　　者：冯明海[1] 方亮[1] 刘高斌[1] 侯爱国[1] 张勇[1] 王万录[1] 

机构地区：[1]重庆大学应用物理系,重庆400044

出　　处：《材料导报》2006年第1期101-103,108,共4页Materials Reports

基　　金：国家自然科学基金(50345021)重庆市自然科学重点基金(CSTC2005BA4016)

摘　　要：金刚石因其卓越的物理和化学性能一直蕴涵着巨大的应用潜力,但其极高的硬度和优异的化学稳定性使其难以被加工成型,因此,在作为新型电子功能材料走向实际应用过程中,金刚石的微细加工技术非常关键。对近年来国内外采用等离子体刻蚀技术加工金刚石的基本工艺特点和最新进展进行了较系统的比较和总结,重点分析了功率、气体种类、气体流量、偏压、掺杂类型、离子注入、掩膜等因素对刻蚀过程的影响,以期为工艺参数的进一步优化提供参考。Due to the excellent physical and chemical properties,diamond has magnitude application potential. But its extremely hardness and chemical inertness make it difficult to be fabricated. Hence, as a new functional material, diamonds micro-fabrication technology is crucial for practical＇applications. In this paper, the characteristics of etching diamond by various plasma etching technologies both at home and abroad are compared and summarized. The effect of the technique factors （such as power, gas category, gas flow, bias, doping type, ions implantation, mask ）, on the etching process has been mainly analyzed, so as to provide a reference or guide for further optimization of the technical parameters.

关 键 词：金刚石 微细加工 刻蚀 等离子体 

分 类 号：TN405.98[电子电信—微电子学与固体电子学] TQ163[化学工程—高温制品工业]