复杂微结构三维形貌测量方法的研究  

Research on 3-D Profile Measurement Method for Complex Micro-structures

作　　者：胡春光[1] 胡晓东[1] 徐临燕[1] 郭彤[1] 胡小唐[1] 

机构地区：[1]天津大学精密测试技术及仪器国家重点实验室,天津300072

出　　处：《光电子．激光》2006年第1期98-101,共4页Journal of Optoelectronics·Laser

基　　金：国家"863"计划重大专项资助项目(2004AA404042);天津市重大科技资助项目(043185911)

摘　　要：微结构三维形貌测量是研究微加工工艺和微尺寸特性的重要测试内容。本文提出一种基于相移显微干涉术、利用干涉图建立二维结构模板指导相位展开的新方法,它不仅适用于静态测量,而且能应用于在动态测量中,特别是微机电系统(MEMS)器件的运动测量。以微谐振器为测试器件,对其运动梳齿结构进行了静态三维形貌测量,实验的离面理论测量精度优于0.5 nm,测试结构内部的面内理论测量精度优于0.5μm,而边缘尺寸因受到边缘提取方法的影响,其测量精度仅在μm量级。对该方法的缺点和发展方向做了探讨。Micro-structure 3-D profile measurement is an important measurement content for research on micro-machining and characterization of micro-dimension. In this paper,a new method combining 2-D structure template, which guides phase unwrapping, is proposed based on phase-shifting microscopic interferometry. It is fit for static measurement and dynamic measurement, especially for motion of micro electro-mechanical systems （MEMS） devices. 3-D profile of active comb of micro-resonator is obtained using the method. The theoretic precision in out-of-plane direction is better than 0.5 nm. The in-plane theoretic precision in micro-structures is better than 0.5μm. But at the edge of micro-structures, it is on the level of micrometer,which is mainly caused by imprecise edge analysis. Finally, its disadvantages and the following development are discussed.

关 键 词：微结构 三维形貌测量 相移显微干涉术 二维结构模板 生长算法 

分 类 号：TN247[电子电信—物理电子学]