电铸Ni-SiC金属基复合材料的抗拉强度与微观结构分析  

The Analysis of Tensile Strength and Microstructure of Ni-SiC Composites Prepared by Electroforming

作　　者：刘磊[1] 赵海军[1] 胡文彬[1] 沈彬[1] 

机构地区：[1]上海交通大学金属基复合材料国家重点实验室,上海200030

出　　处：《上海交通大学学报》2006年第1期120-123,128,共5页Journal of Shanghai Jiaotong University

基　　金：国家高技术研究发展计划(863)项目(2002AA334010);上海市科委重点新材料项目(035211037);上海市科技发展基金项目(0211nm052)

摘　　要：在氨基磺酸镍镀液中电铸制备了两种不同SiC微粒含量的复合材料,研究了热处理对复合材料的抗拉强度和微观组织的影响.研究表明,300℃热处理提高了两种复合材料的强度;但600℃热处理却降低了强度.基体金属Ni与SiC颗粒在600℃完全反应后,界面反应产物是Ni3Si、游离石墨和少量的Ni31Si12,并且产生相当于SiC微粒体积8%的微孔.断裂过程经历微裂纹萌生、长大和聚集,以基体断裂、界面脱粘和微粒断裂三种方式进行.Ni-SiC metal matrix composites with two kinds of SiC content were prepared by electroforming in a nickel sulphamate bath. The effect of heat treatment on tensile strength and microstructure of Ni-SiC composites were investigated. The heat treatment at 300℃ increases tensile strength, but the heat treatment at 600℃ decreases the tensile strength. The complete reaction between nickel and SiC particles can produce shrinkage pores in the interface. In addition, the volume of shrinkage pores is equal to 8% of that of SiC particles in the composites. The interfacial reaction products are composed of Ni3Si and a little amount of Ni31Si12 at 600℃. The fracture process includes microcracks initiation, growth, and coalescence. The cracking of the matrix, debonding of Ni-SiC interface and cracking of particles are three types of cracking modes.

关 键 词：电铸 Ni—SiC复合材料 抗拉强度 微观结构 界面反应 断裂 

分 类 号：TB331[一般工业技术—材料科学与工程]