微纳加工技术在微纳电子器件领域的应用  

Applications of micro/nanofabrication on micro/nano electrical devices

作　　者：刘明[1] 陈宝钦[1] 谢常青[1] 王丛舜[1] 龙世兵[1] 徐秋霞[1] 李志钢[1] 易里成荣[1] 涂德钰[1] 

机构地区：[1]中国科学院微电子研究所纳米加工与新器件集成技术实验室,北京100029

出　　处：《物理》2006年第1期47-50,共4页Physics

基　　金：国家自然科学基金(批准号:60276019;90207004;60236010;60290081)资助项目

摘　　要：微纳加工技术推动着集成电路不断缩小器件尺寸和提高集成度,光学光刻技术依然是目前的主流微纳加工技术,同时有多种替代技术如电子束直写、极紫外光刻和投影电子束技术,文章介绍了自上而下的微纳加工技术的进展及其在微纳器件研制的重要作用.Micro/nano fabrication is the dominant factor in increasing the number of components per chip and further shrinking the size of devices. Until now, optical lithography has been the mainstream technology for the integrated circuit industry. For dimensions smaller than 45nm it is still undecided what is the best exposure method. Options include electron beam direct writing and projection, and extreme ultraviolet （EUV） exposure. Recent progress in top-down nano-fabrication processes such as optical, electron beam and EUV lithography, and their applications in manufacturing nano-devices are reviewed.

关 键 词：纳米加工 纳米器件 微纳加工技术 光学光刻技术 

分 类 号：TN405[电子电信—微电子学与固体电子学]