无机填料对填充型聚合物介电性能影响的研究  

A Study on Influence of Inorganic Fillers on Dielectric Properties of Filled Polymers

作　　者：朱雨涛[1] 谢恒堃[1] 金维芳[1] 刘耀南[1] 

机构地区：[1]西安交通大学

出　　处：《电工技术学报》1996年第5期11-14,共4页Transactions of China Electrotechnical Society

基　　金：国家自然科学基金资助项目

摘　　要：运用电路模型和Maxwell-Wagner-Sillars界面极化模型研究了无机填料对于填充型聚合物介电性能的影响。在用白碳黑填充的乙丙橡胶试样上获得了界面极化存在的证据。理论分析与试验结果都表明,填料对复合体系电性能的影响与填料粒子的尺寸、浓度及分散状况密切相关,并在界面处引起一个复杂的弛豫过程。Effects of inorganic fillers on dielectric propertces of filled polymer were studied by using circuits model and interfacial polarization MWS model. Evidence of interfacial polarization was obtained for EPR samples filled with silica. Both theoretical analysis and experiments show that the influence of fillers relates closely with their particle size, concentration and distribution in the compound, while a complex relaxation process at interfaces is produced.

关 键 词：无机填料 聚合物 介电性能 绝缘材料 

分 类 号：TM215.101[一般工业技术—材料科学与工程]