新型高速氨性镀镍液性能的研究  

Performances of new compouned nickel-ammonia quick plating baths

作　　者：杨洋[1] 潘秉锁[2] 杨凯华[2] 

机构地区：[1]中国地质大学研究生院,武汉430074 [2]中国地质大学工程学院,武汉430074

出　　处：《金刚石与磨料磨具工程》2006年第1期68-70,共3页Diamond & Abrasives Engineering

基　　金：中国地质大学优秀教师资助计划项目(CUCQNB0305)

摘　　要：研究了高速氨性镀镍液的性能。首先通过分析电流效率随电流密度的变化情况确定了镀液的许用电流密度, 然后测定了氨的含量、镀液pH值、甲酸钠的含量等因素对分散能力、深镀能力、抗杂性能等镀液性能的影响。试验结果表明,研究的镀镍液体系许用电流密度达8．0A／dm2,电镀速度比瓦特型镀镍液配方提高4倍左右,分散能力提高了 16％,镀液的深镀能力也显著提高,而且镀液具有良好的抗铜离子的能力,抗铁离子的能力不太显著。In this paper, the performances of ammoniac nickel quick plating bath are studied. Allowable current density is firstly confirmed by analyzing the variation of et/rrent efficiency with current density. Effects of content of ammonia ions, pH value and the content of sodium formate upon the throwing power, cover/ng power and ability of anti-impurities, were measured. The tests results showed that the allowable current density of nickel-plating bath system studied could reach 8.0A/dm^2, the electroplating rate of this bath increased by 4 times that of Watts nickel-plating bath, the throwing power increased by 16%, the covering power of this bath also increased remarkably, and the developed solutions had favorable anti-copper ions ability while the anti-iron ability was not obvious.

关 键 词：高速电镀 镀镍溶液 硫酸氨 甲酸钠 

分 类 号：TQ153.12[化学工程—电化学工业] TQ153.2