喷射沉积硅铝电子封装材料的组织与性能  

Microstructures and properties of Si-Al alloy for electronic packaging prepared by spray deposition technique

作　　者：田冲[1] 陈桂云[1] 杨林[2] 赵九洲[1] 

机构地区：[1]中国科学院金属研究所,沈阳110016 [2]沈阳工业大学,沈阳110023

出　　处：《功能材料与器件学报》2006年第1期54-58,共5页Journal of Functional Materials and Devices

摘　　要：采用喷射沉积技术制备了电子封装材料70％Si—Al合金板材，制备的合金具有细小均匀的组织结构，各向同性，Si相粒子分布弥散。分析表明合金具有和半导体材料接近的热膨胀系数（7×10^-6～8×10^-6／℃）、优良的导热性能（〉100W／m·K），实验表明合金具有较好的机械加工性能，可以用普通的刀具进行加工，初步研究了热等静压在合金制备中的应用。An electronic package material, silicon -aluminum alloy （70%Si -Al） strip was developed by using spray deposition technique. The high - silicon alloy prepared has fine, isotropie mierostruetures with fine Si phase particles dispersing in A1 matrix uniformly. Investigations show that the 70% Si - Al alloy has low constant of thermal linear expansion （ 7 × 10^ -6- 8 ×10^ -6/℃ ） and excellent properties of heat conductivity（ 〉 100W/m · K）. It is also shown that the alloy has good maehinability. It can be readily processed by conventional carbon tools. Hot isostatic pressing （HIP） is used for compacting the as - deposited alloys.

关 键 词：硅铝合金 电子封装 喷射沉积 热膨胀 导热性能 

分 类 号：TG146[一般工业技术—材料科学与工程]