单晶硅微桥式梁力学性能的弯曲测试  

Bending Test of Single Crystal Silicon Micro-bridge Beams for Mechanical Properties

作　　者：韩光平[1] 刘凯[1] 王秀红[2] 

机构地区：[1]西安理工大学,西安710048 [2]郑州航空工业管理学院,郑州450015

出　　处：《仪器仪表学报》2006年第2期176-179,208,共5页Chinese Journal of Scientific Instrument

摘　　要：微梁是微电子机械系统（MEMS）中常见的结构，单晶硅是MEMS最基本、最常用的材料之一，其材料力学性能需要精确的评价。应用光刻等技术加工了六组不同尺寸的微桥式梁试件，并进行了弯曲测试，梯形截面的试件可代表矩形、方形等截面的常见微梁。弯曲测试选用的纳米压痕法适用于弹塑性材料，且可同时获取弹性模量、硬度和弯曲强度等多种力学性能参数。实验测得单晶硅的平均弹性模量为（170．295±2．4850）GPa，没有呈现尺寸效应；弯曲强度在3．24～10．15GPa范围内变化，有较强的尺寸效应，平均硬度为（9．4967±1．7533）GPa，尺寸效应不太明显。Micro beams may be often found in MEMS （micro electro mechanical systems） and single crystal silicon is one of the most fundamental materials applied in MEMS, therefore, it is in urgency to accurately evaluate the material mechanical properities of single silicon usually making up of micro beams. Six kinds of micro-bridge beam specimens with different sizes were fabricated by using photolithography technology for bending test. Beam specimens with trapezoidal section could be representative of those with rectangle and square sections, which are usually applied in MEMS. Nano indentation method used in bending test can be applied to both elastic and plastic materials. The average elastic modulus of single crystal silicon is （170. 295±2. 4850） GPa ,showing no size effects, but the bending strength ranges from 3.24GPa to 10. 15GPa, displaying strong size effects, and the average hardness is （9. 4967±1. 7533）GPa,no obvious size effects are observed.

关 键 词：微电子机械系统 纳米压痕法 力学性能 尺寸效应 弯曲测试 

分 类 号：TH112[机械工程—机械设计及理论]