无氰仿金电镀的研究现状  

Research status of non-cyanide imitating gold electroplating

作　　者：何丽芳[1] 郭忠诚[1] 

机构地区：[1]昆明理工大学新材料与表面工程研究开发中心,云南昆明650093

出　　处：《电镀与涂饰》2006年第3期51-54,共4页Electroplating & Finishing

摘　　要：对焦磷酸盐体系、甘油-锌酸盐体系、柠檬酸盐体系、酒石酸盐体系以及HEDP体系等无氰仿金电镀体系的各工艺规范以及3种仿金镀层钝化工艺配方进行了介绍。对离子仿金电镀工艺的优点、常用仿金离子镀镀层的种类和性能进行了概括。指出了仿金镀层各种保护漆涂覆工艺存在的问题以及无氰仿金电镀工业今后的发展方向。The process criteria of non-cyanide imitating gold electroplating including systems of pyrophosphate, glycerolzincate, citrate, tartrate and HEDP, and the passivation process formulae of three kinds of imitating gold electroplating were introduced. The advantages of ion imitating gold electroplating, process sorts and properties of common imitating ion plating deposits were summarized. The existing problems in painting technics of various protective lacquer for imitating gold plating deposit and development trends of non-cyanide imitating gold plating industry were presented.

关 键 词：无氰仿金电镀 HEDP电镀 工艺规范 配方 

分 类 号：TQ153.2[化学工程—电化学工业]