添加Ag对Sn-9Zn无铅钎料合金性能的影响  

Effects of Ag Addition on Properties of Sn-9Zn Lead-free Solder Alloys

作　　者：黄惠珍[1] 黄起森[1] 彭曙[1] 周浪[1] 

机构地区：[1]南昌大学

出　　处：《特种铸造及有色合金》2006年第3期179-181,共3页Special Casting & Nonferrous Alloys

摘　　要：通过试验研究了添加Ag对Sn-9Zn无铅钎料合金在Cu表面的润湿性、焊点剪切强度、抗蠕变性能与组织的影响。结果表明，当添加量较低时，Ag能够改善Sn-9Zn合金熔体对Cu的润湿性和焊点剪切强度，而添加量较高时Ag则会使它们降低；就焊点润湿性和剪切强度而言，最佳Ag含量（质量分数）为0．30％～0．60％。Ag的添加能显著提高Sn-9Zn合金体材的抗蠕变性能。显微分析表明，在含Ag合金中形成了弥散分布、尺度为微米级的Ag—Zn化合物颗粒，这可能是合金得到强化的原因。Effects of Ag addition on the wettability on the copper surface, shear strength of solder joints, creep strength and microstructure of Sn-9Zn lead-free solder alloys have been investigated experimentally. The results show that lower Ag addition can improve the wettability and shearing strength of solder joints of Sn-9Zn alloy melt on the Cu surface while higher Ag addition can be inferior to them. There exists an optimum Ag content ranging from 0.3 % to 0.6% for wettability and shearing strength of solder joints. The creep strength of Sn-9Zn solder alloys can be increased by the addition of Ag, which may be attributed to the micrometer-sized dispersed Ag-Zn particles formed in the bulk of Sn-9Zn-xAg solder alloy.

关 键 词：无铅钎料 SN-9ZN AG 润湿力 蠕变 

分 类 号：TG425[金属学及工艺—焊接]