电子封装用聚苯硫醚高性能复合材料的研制  

Study on high performance polyphenylene sulfide composite materials for electronic encapsulation

作　　者：郭岳[1] 余自力[1] 李玉宝[1] 

机构地区：[1]四川大学材料科学技术研究所,四川成都610064

出　　处：《功能材料》2006年第3期402-404,共3页Journal of Functional Materials

基　　金：国家高技术研究发展计划(863计划)资助项目(2003AA31X020)

摘　　要：微电子工业的快速发展迫切需要性能更为优异的封装材料。采用聚苯硫醚复合材料作为电子封装材料,具有使用温度高、热膨胀系数低、介电损耗低、电绝缘性能好等优异的性能,应用于现代微电子领域的前景良好。本文用国产商品PPS树脂经纯化处理后,与其它材料复合,成功制备出了聚苯硫醚高性能电子封装材料,制备的PPS电子封装材料具有低吸水性、低热膨胀系数、高强度以及优异的介电性能等综合性能,优于目前常用的环氧类电子封装材料。The composition of PPS was obtained by mixing purified commercial PPS resin, inorganic filler and other processing aids together. The mixtures are extruded in a two-screw extruder to strands and chopped to pellets, and then the pellets are injection molded to testing specimen for property measurements. The data of measurement show that the thermal, mechanical, electrical properties and inflammability of obtained composite are better than those of composite materials based on epoxy resin and organo-silicon resin for electronic encapsulation. It could be used as high performance materials for electronic encapsulation.

关 键 词：高性能 聚苯硫醚 电子封装材料 

分 类 号：O632[理学—高分子化学] O633.3[理学—化学]