嵌入式系统软/硬件协同设计技术综述  

Survey on techniques of SoC hardware/software co-design

作　　者：熊光泽[1] 詹瑾瑜[1] 

机构地区：[1]电子科技大学计算机科学与工程学院,四川成都610054

出　　处：《计算机应用》2006年第4期757-760,764,共5页journal of Computer Applications

基　　金：国家863计划资助项目(2003AAIZ2210)

摘　　要：随着微电子技术和计算机技术的飞速发展,嵌入式产品广泛应用于消费电子、智能家电、通信设备等多个领域。介绍了嵌入式系统现状,分析了今后的发展趋势,阐述了传统方法的缺陷,介绍了一个新的设计方法学———SoC(片上系统)嵌入式系统软/硬件协同设计,并较详细分析了支撑该方法学的相关技术。With the increasing development of the technology in microelectronies and computer science, embedded applications are widely used in many fields, such as consumer electronics, intelligent electronic household appliances, and communication equipments. The present status of embedded system was introduced, the trend in the future was analysed, the deficiency of the traditional design methods was presented. The hardware/software co-design methodology of SoC embedded systems was proposed, the supporting techniques were given.

关 键 词：嵌入式系统 协同设计 重用 片上系统 IP核 软件构件 协同综合 测试调度 

分 类 号：TP39[自动化与计算机技术—计算机应用技术]