当代多芯片组装技术  

Contemporary multichip modules technology

作　　者：谢顺坤[1] 

机构地区：[1]重庆光电技术研究所

出　　处：《半导体光电》1996年第3期218-223,共6页Semiconductor Optoelectronics

摘　　要：与传统的封装技术相比，多芯片组装技术具有更高的封装密度和更优异的性能。多芯片组装技术正在蓬勃发展，是当代的代表性技术。文章在简要介绍多芯片组装的工艺、材料选择及构成形式之后。As compared with traditional package technologies,multichip module(MCM) technology has the higher packing densities and the more excellent characteristics.MCM technology is vigorously developing and it's one of the representative technoloies.MCM's fabrication and measurment are described in detail after briefly introducting the techniques of MCM,materials selections and constitution forms.

关 键 词：半导体工艺 多芯片 组装技术 功能模块 特性测试 

分 类 号：TN305[电子电信—物理电子学] TN605