后续烧结工艺对激光微细熔覆制备厚膜电阻性能的影响  

Effect of Subsequently Sintered Processing on Properties of Thick-Film Resistor Directly Fabricated by Laser Micro-Cladding

作　　者：李慧玲[1] 曾晓雁[1] 

机构地区：[1]武汉光电国家实验室激光部华中科技大学激光加工国家工程研究中心,湖北武汉430074

出　　处：《中国激光》2006年第4期570-576,共7页Chinese Journal of Lasers

基　　金：国家863计划基金(2001AA421290;2005AA311030);国家自然科学基金(5057086)资助项目

摘　　要：随着电子产品逐渐向微型化、多功能化和高密化的方向发展,传统的厚膜技术由于存在着大量的局限性,越来越不能满足这种快速发展的需求,因此,采用激光微细熔覆柔性直接制造技术在Al2O3基板上制备了高精度、高质量的厚膜电阻。然而,由于激光和物质的相互作用是一个急热急冷的过程,与传统的烧结工艺对厚膜电阻的作用不同,造成最终电阻的组织性能不同,因此,着重研究了激光加工工艺和后续烧结工艺对厚膜电阻的组织性能的影响,并对这种影响的主要机理进行了分析。结果表明,激光微细熔覆柔性直接制造的厚膜电阻比采用后续烧结工艺制备的电阻性能可靠、稳定,而且工艺简单灵活,效率高,不需要后续烧结过程,节省了能源,降低了成本。With the development of electronic product to micro-miniaturization, multifunction and high density, the conventional technology could not fulfill the rapidly growing need for its inherent limits. In this paper, the laser micro-cladding technique is used to fabricate thick-film resistor with high precision, reliability and quality on Al2O3 substrate. However, structure and properties of thick film resistor fabricated by this technology are different from conventional sintering processing because the interaction of laser and matter is a totally different process due to its rapid beating and cooling. The effect of laser processing and subsequently sintered processing on the structure property of thick-film resistor is studied, and the principal mechanisms are analyzed. The experimental results demonstrated that the thick-film resistor fabricated by laser micro cladding has high reliability and stability compared with the subsequently sintered methods, especially it possesses high precision, flexible and simple processing, low cost and short production cycle etc.

关 键 词：激光技术 厚膜电阻 激光微细熔覆 柔性直写 

分 类 号：TN605[电子电信—电路与系统] TG665[金属学及工艺—金属切削加工及机床]