自适应无铅焊料的开发与研究  

Development and Research of Self-adaptive Lead-free Solders

作　　者：韦晨[1] 刘永长[1] 韩雅静[1] 沈骏[1] 

机构地区：[1]天津大学材料科学与工程学院金属材料系,天津300072

出　　处：《材料导报》2006年第3期119-121,131,共4页Materials Reports

基　　金：国家自然科学基金项目(No.50401033);全国优秀博士学位论文作者专项基金项目(No.200335);天津大学大型设备开放基金资助项目

摘　　要：可靠性是电子工业发展所面临的最大难题。随着对无铅焊料的深入研究,消除金属间化合物对焊点机械性能的不利影响,及解决由于印刷电路板与电子材料间的热膨胀系数不同所产生的、在热循环过程中出现的热疲劳现象,都是提高可靠性的途径。提出了开发自适应无铅焊料解决上述问题,阐述了制备自适应无铅焊料的可行性,并展望了此种焊料的良好应用前景。Electronic industry faces a crucial problem of reliability. With deeper insights into the lead-free solders, there are two effective ways for improving its reliability, eliminating the disadvantages for the mechanical properties of the solder joints caused by intermetallic phases and avoiding the thermal fatigue emerged during thermal cycling due to the different coefficients of thermal expansion between the packaged components and the printed circuit board. Here further development of self-adaptive lead-free solders is proposed to solve these problems, and the possible preparation methods and prospect application of self-adaptive lead free solders are summarized as well.

关 键 词：无铅焊料 形状记忆 金属间化合物 

分 类 号：TN405[电子电信—微电子学与固体电子学] TS252.54[轻工技术与工程—农产品加工及贮藏工程]