不同制备工艺对高硅铝合金组织及力学性能的影响  

Microstructures and Mechanical Properties of High Silicon Aluminum Alloy Effected by Different Process

作　　者：甘卫平[1] 刘泓[1] 杨伏良[1] 

机构地区：[1]长沙中南大学材料科学与工程学院,410083

出　　处：《材料导报》2006年第3期126-128,共3页Materials Reports

基　　金：国防科学技术工业委员会资助项目(MKPT-03-151)

摘　　要：针对航空航天电子封装用轻质高硅铝合金材料，采用铸轧工艺、喷射沉积工艺和粉末包套热挤压工艺制备了硅含量高达3SYo的高硅铝合金，利用金相显微镜、万能电子拉伸机、SEM对3种不同工艺所制备材料的微观组织、力学性能及断口进行了检测分析。结果表明：在含硅量相差不大时，粉末包套热挤压工艺成型材料的硅相细小，可达到2～10μm，且分布弥散均匀，抗拉强度达到174MPa，比铸轧工艺成型材料的强度提高了86．1％，比喷射沉积工艺成材料的强度提高了57．2％。Light high-silicon aluminum alloy is used for electronic packaging in the aviation and space-flight, here we call it hypereutectic high-silicon aluminum alloy. Al-35Si can be fabricated with cast, rapid solidification/powder metallurgy and spray deposition. Optical microscopy, universal material testing machine, SEM are used to study the microstructure, tensile strength and fracture of the products processed by the three methods. Experimental results indicate that the size of powder metallurgy silicon crystal is the smallest among three process, they are 2～10μm and uniformly distributed. The press strength of powder metallurgy reaches 174MPa, it is more than cast by 86. 1% and more than rapid solidification by 57. 2%.

关 键 词：电子封装 粉末冶金 喷射沉积 熔铸 Al—Si合金 

分 类 号：TG146.21[一般工业技术—材料科学与工程] U465.22[金属学及工艺—金属材料]