新型潜伏性环氧树脂体系固化动力学  

Study on the Curing Kinetics of the Novel Latent Epoxy Resin Systems

作　　者：邢素丽[1] 王遵[1] 曾竟成[1] 肖加余[1] 杨孚标[1] 邱求元[1] 

机构地区：[1]国防科技大学航天与材料工程学院,湖南长沙410073

出　　处：《国防科技大学学报》2006年第2期31-34,共4页Journal of National University of Defense Technology

基　　金：国防科技重点实验室基金项目(51489040105KG0101);国家部委资助项目(41327020301)

摘　　要：采用非等温差示扫描量热(DSC)技术对改性咪唑类固化剂(MIM)及其微胶囊固化剂(MIC)与E-51环氧树脂的固化反应过程进行了跟踪,并利用Kissinger和Crane方程对该固化反应进行了动力学分析,在此基础上探讨了固化剂包覆处理前后其环氧树脂体系的固化动力学参数与固化剂室温贮存性能的关系。结果表明:在不同升温速率下,E-51/MIM反应体系的放热量均大于E-51/MIC体系;两固化反应体系的反应级数均为0.89;与E-51/MIM体系相比,E-51/MIC体系的固化反应活化能和频率熵因子均较大,并具有更好的室温贮存性能。The curing processes of E-51 epoxy resin with two types of curing agents, such as a modified 2-ethyl-4-methylimidazole （MIM） and a microcapsule type curing agent with MIM as the core material （MIC）, were studied in detail by the non-isothermal differential scanning calorimeter （DSC） technique respectively, and the kinetics of the curing processes were analyzed by Kissinger and Crane equations, based on which the relationship between the curing kinetic parameters of the curing systems with the storage lives of the curing agents at room temperature were discussed in detail. Compared with E-51/MIN system at different heating rates, it was found that E-51/MIC system exhibited lower exothermic heat, the same reaction order （0.89）, higher apparent activation energy, higher frequency factor and longer storage life at room temperature.

关 键 词：潜伏性固化剂 微胶囊 固化反应动力学 环氧树脂 差热分析 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]