PZT陶瓷表面金属化的研究──（Ⅳ）后处理的实施及其作用  

METALLIZATION OF PZT CERAMIC SURFACE──(Ⅳ) POST-TREATMENTS AND THEIR EFFECTS ON METALLIZATION

作　　者：施宪法[1] 李学静[1] 刘艳生[1] 郑企雨[1] 

机构地区：[1]同济大学化学系

出　　处：《中国有色金属学报》1996年第1期44-48,共5页The Chinese Journal of Nonferrous Metals

基　　金：国家教委重点科研课题

摘　　要：利用化学镀方法在ＰＺＴ陶瓷表面制得的镀镍层，必须经过后处理才能最后完成ＰＺＴ陶瓷表面金属化过程，以制成合用的镍电极。后处理包括电镀镍及低温、高温热处理等步骤。本文报导了这种后处理的实施过程、控制条件及其结果，并讨论了后处理对于ＰＺＴ陶瓷表面金属化及对ＰＺＴ陶瓷元器件的电学性能的影响。The plated Ni layer on PZT ceramics by electroless plating must be carried out a post-treatment,which involved a Ni-electroplating process and double step heat-treatments at 200℃ in air and at 400～460℃ in N_2 atmosphere respectively. The experimental procedures of the post-treatment were investigated, and its effects on the metallization of PZT ceramic surface and the properties of the PZT ceramic components were discussed too.

关 键 词：PZT陶瓷 电镀 热处理 压电陶瓷 镀镍 

分 类 号：TM282.051[一般工业技术—材料科学与工程] TQ153.3[电气工程—电工理论与新技术]