应用XRF法对陶瓷金属化厚度的检测  

Measurements of the Thickness of Metallization Layer on Alumina Ceramic through XRF

作　　者：曾敏[1] 伍智[1] 金大志[1] 杨卫英[1] 邹桂娟[1] 

机构地区：[1]中国工程物理研究院电子工程研究所,四川绵阳621900

出　　处：《真空电子技术》2006年第2期40-42,共3页Vacuum Electronics

摘　　要：采用X射线荧光光谱（XRF）法研究了陶瓷金属化厚度的无损检测方法,进行了检测用标准片的设计和标定,分析了金属化层成分与含量,建立了XRF无损检测厚度方法的应用程序和校准方法.研究结果表明：采用X射线荧光光谱法,对陶瓷金属化厚度进行无损检测是可行的和可靠的;在试验的范围内（12.66～87.02μm）,测量误差小于5%,RSD小于2%.A scatheless method to measure the thickness of metallization layer on alumina ceramic through XRF was developed. The ingredients of metallization layer were analyzed qualitatively and quantitatively. Standard samples for measuring were designed and calibrated. Programs for scatheless measurement and corresponding adjustment methods were also established. The designed method is applicable and credible, according to the experimental results that the measurement error was less than 5% and the relative standard deviation was less than 2 % within the measuring range from 12.66 μm to 87.02 μm.

关 键 词：陶瓷金属化厚度 X射线荧光光谱法 无损检测 

分 类 号：TN107[电子电信—物理电子学]