无氰镀金工艺的研究  

A Study of Cyanide-free Gold Plating Process

作　　者：曹人平[1] 肖士民[1] 

机构地区：[1]华南理工大学化学科学学院,广东广州510640

出　　处：《电镀与环保》2006年第1期11-14,共4页Electroplating & Pollution Control

摘　　要：由于氰化物镀金含有剧毒的氰化物,为了保护工人的身体健康和减少对环境的污染,研究亚硫酸盐无氰镀金工艺,该工艺可以得到耐蚀性优良、抗变色性能好、导电性好、焊接性好、接触电阻低,且稳定、耐高温、质软、耐磨的镀金层,同时介绍了镀金时应注意的事项和影响因素。Since highly toxic cyanide is involved in cyanide electroplating, to protect platers＇ health and diminish pollution to environment, a cyanide-free sulfite gold plating technology is studied. With this process, you can get a gold coating characterized by good corrosion resistance, tarnish resistance, conductivity and soldering property, low and reliable contact resistance, high temperature resistance, good ductility and wear resistance, etc. The cautions and affecting factors during the plating are also described.

关 键 词：无氰 镀金 工艺研究 无氰镀金工艺 

分 类 号：TQ153.1[化学工程—电化学工业]